Wednesday, February 4, 2009

Novel camera technology enables new products, form factors

In a press release earlier this year, Tessera (TSRA) announced a new technology for making extremely small and lower cost camera modules for devices such as camera phones, webcams and security cameras. The size reduction possible with the new technology Tessera calls OptiML™ Wafer Level Camera Technology is impressive as shown in the illustration below.

OptiML™ Wafer Level Camera

This reduction in camera size will enable designers of mobile phones and other portable products to fashion still more compact devices. The design of earlier products, particularly the thickness, has often been dictated by the height of the included camera module. Using Tessera’s technology, product designers will be free to incorporate cameras in extremely thin new designs. The reduced size and cost of camera modules will also enable designers to place cameras in entirely new product categories.

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